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IRFP460 Datasheet, PDF (3/7 Pages) NXP Semiconductors – PowerMOS transistors Avalanche energy rated
Philips Semiconductors
PowerMOS transistors
Avalanche energy rated
120 PD%
Normalised Power Derating
110
100
90
80
70
60
50
40
30
20
10
0
0 20 40 60 80 100 120 140
Tmb / C
Fig.1. Normalised power dissipation.
PD% = 100⋅PD/PD 25 ˚C = f(Tmb)
ID%
120
Normalised Current Derating
110
100
90
80
70
60
50
40
30
20
10
0
0 20 40 60 80 100 120 140
Tmb / C
Fig.2. Normalised continuous drain current.
ID% = 100⋅ID/ID 25 ˚C = f(Tmb); conditions: VGS ≥ 10 V
Peak Pulsed Drain Current, IDM (A)
100
10
RDS(on) = VDS/ ID
d.c.
1
PHW20N50E
tp = 10 us
100us
1 ms
10 ms
100 ms
0.1
10
100
Drain-Source Voltage, VDS (V)
1000
Fig.3. Safe operating area. Tmb = 25 ˚C
ID & IDM = f(VDS); IDM single pulse; parameter tp
Product specification
IRFP460
Zth j-mb (K/W)
1
D = 0.5
PHW20N50E
0.2
0.1 0.1
0.05
0.02
0.01
PD tp D = tp/T
0.001
1E-06
single pulse
T
1E-05 1E-04 1E-03 1E-02 1E-01 1E+00 1E+01
Pulse width, tp (s)
Fig.4. Transient thermal impedance.
Zth j-mb = f(t); parameter D = tp/T
Drain Current, ID (A)
20
Tj = 25 C
18
16
PHW20N50E
VGS = 10 V
8V
14
12
5V
10
4.8 V
8
4.6 V
6
4.4 V
4
4.2 V
2
4V
0
0
1
2
3
4
5
Drain-Source Voltage, VDS (V)
Fig.5. Typical output characteristics.
ID = f(VDS); parameter VGS
Drain-Source On Resistance, RDS(on) (Ohms) PHW20N50E
0.5
4V 4.2V
4.6 V
Tj = 25 C
4.4 V
4.8V 5V
0.45
0.4
0.35
0.3
VGS = 6 V
0.25
10V
0.2
0 2 4 6 8 10 12 14 16 18 20
Drain Current, ID (A)
Fig.6. Typical on-state resistance.
RDS(ON) = f(ID); parameter VGS
September 1999
3
Rev 1.000