BYV160 Datasheet, PDF (3/8 Pages) NXP Semiconductors – Ultra fast low-loss rectifier

Philips Semiconductors
Ultra fast low-loss rectifier
Product specification
BYV160
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE UNIT
R_{th j-tp}
R_{th j-a}
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
lead length = 10 mm
note 1
46
K/W
100
K/W
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.8.
For more information please refer to the ‘General Part of associated Handbook’.
2000 Feb 01
3