BY448 Datasheet, PDF (3/7 Pages) NXP Semiconductors – Damper diode

Philips Semiconductors
Damper diode
Product specification
BY448
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
R_{th j-tp}
R_{th j-a}
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
CONDITIONS
lead length = 10 mm
note 1
mounted as shown in Fig.5
VALUE
46
100
55
UNIT
K/W
K/W
K/W
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.4.
For more information please refer to the “General Part of associated Handbook”.
1996 Sep 26
3