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BY228 Datasheet, PDF (3/7 Pages) NXP Semiconductors – Damper diode | |||
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Philips Semiconductors
Damper diode
Product speciï¬cation
BY228
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-tp
Rth j-a
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
CONDITIONS
lead length = 10 mm
note 1
mounted as shown in Fig.5
VALUE
25
75
40
UNIT
K/W
K/W
K/W
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer â¥40 µm, see Fig.4.
For more information please refer to the âGeneral Part of associated Handbookâ.
1996 Sep 26
3
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