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BUK220-50Y Datasheet, PDF (3/8 Pages) NXP Semiconductors – TOPFET high side switch SMD version of BUK219-50Y | |||
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Philips Semiconductors
TOPFET high side switch
SMD version of BUK219-50Y
Product Specification
BUK220-50Y
STATIC CHARACTERISTICS
Limits are at -40ËC ⤠Tmb ⤠150ËC and typicals at Tmb = 25 ËC unless otherwise stated.
SYMBOL PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
Clamping voltages
VBG
Battery to ground
VBL
Battery to load
-VLG
Negative load to ground
-VLG
Negative load voltage1
IG = 1 mA
IL = IG = 1 mA
IL = 10 mA
IL = 1 A; tp = 300 µs
50 55 65
V
50 55 65
V
18 23 28
V
20 25 30
V
Supply voltage
VBG
Operating range2
battery to ground
-
5.5
-
35
V
Currents
IB
Quiescent current3
IL
Off-state load current4
IG
Operating current5
IL
Nominal load current6
9 V ⤠VBG ⤠16 V
VLG = 0 V
VBL = VBG
IL = 0 A
VBL = 0.5 V
-
Tmb = 25ËC
-
-
Tmb = 25ËC
-
-
2
-
20 µA
0.1
2
µA
-
20 µA
0.1
1
µA
2
4 mA
-
-
A
Resistances
RON
On-state resistance7
RON
On-state resistance
VBG
IL
tp
Tmb
9 to 35 V 1 A 300 µs 25ËC -
150ËC -
6V
1 A 300 µs 25ËC -
150ËC -
135 180 mâ¦
-
330 mâ¦
170 225 mâ¦
-
410 mâ¦
RG
Internal ground resistance
IG = 10 mA
95 150 190 â¦
1 For a high side switch, the load pin voltage goes negative with respect to ground during the turn-off of an inductive load.
2 On-state resistance is increased if the supply voltage is less than 9 V.
3 This is the continuous current drawn from the supply when the input is low and includes leakage current to the load.
4 The measured current is in the load pin only.
5 This is the continuous current drawn from the supply with no load connected, but with the input high.
6 Defined as in ISO 10483-1. For comparison purposes only. This parameter will not be characterised for automotive PPAP.
7 The supply and input voltage for the RON tests are continuous. The specified pulse duration tp refers only to the applied load current.
July 2001
3
Rev 2.000
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