TFA9881_15 Datasheet, PDF (28/32 Pages) NXP Semiconductors – 3.4 W PDM input class-D audio amplifier

NXP Semiconductors
TFA9881
3.4 W PDM input class-D audio amplifier
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
15.3.4 Cleaning
Cleaning can be done after reflow soldering.
TFA9881
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 23 April 2013
© NXP B.V. 2013. All rights reserved.
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