SA604A_15 Datasheet, PDF (27/31 Pages) NXP Semiconductors – High-performance low-power FM IF system

NXP Semiconductors
SA604A
High-performance low-power FM IF system
Footprint information for reflow soldering of HXQFN16 package
SOT1039-2
4.250
3.300 pa + oa
2.000
1.500
0.500
0.500
0.240
0.0125
0.0125
0.500 0.240
4.250
3.300
pa + oa
2.000
1.500
0.500
0.350
0.800 1.800 2.300 4.000
0.800
1.500
1.800
2.300
4.000
0.350
placement area
solder land
solder paste deposit, -0.02 around copper,
stencil thickness 0.1
occupied area
13-03-25
13-04-22
solder land plus solder paste
solder resist, 0.0625 around copper
clearance, 0.125 around occupied area
Dimensions in mm
Fig 22. PCB footprint for SOT1039-2 (HXQFN16); reflow soldering
sot1039-2_fr
SA604A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4.1 — 30 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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