TDA8822 Datasheet, PDF (24/28 Pages) NXP Semiconductors – Universal I2C-bus programmable RF modulator

Philips Semiconductors
Universal I²C-bus programmable RF
modulator
PACKAGE OUTLINES
SO24: plastic small outline package; 24 leads; body width 7.5 mm
Preliminary specification
TDA8822
SOT137-1
D
y
Z
24
c
13
E
A
X
H_E
vM A
pin 1 index
1
e
12
wM
b_p
A₂
A₁
Q
(A ₃)
A
θ
L_p
L
detail X
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D ⁽¹⁾ E ⁽¹⁾
e
H_E
L
L_p
Q
v
w
y
Z ⁽¹⁾
θ
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25 0.25
0.1
0.9
0.4
8^o
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.050
0.419
0.394
0.055
0.043
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
0^o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT137-1
IEC
075E05
REFERENCES
JEDEC
EIAJ
MS-013AD
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
1997 Jan 08
24