TDA8947J Datasheet, PDF (20/24 Pages) NXP Semiconductors – 4-channel audio amplifier (SE: 1 W to 25 W; BTL: 4 W to 50 W)

Philips Semiconductors
15. Package outline
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
TDA8947J
4-channel audio amplifier
SOT243-1
non-concave
x
Dh
D
Eh
view B: mounting base side
d
A₂
B
j
E
A
L₃
1
17
Z
e₁
wM
b_p
e
L
Q
c
vM
m
e₂
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A₂ b_p
c D⁽¹⁾ d D_h E⁽¹⁾ e e ₁ e ₂ E_h
j
L L₃ m Q
v
w
x Z ⁽¹⁾
mm ^{17.0 4.6 0.75 0.48 24.0 20.0} 10 ^12.2 2.54 1.27 5.08 6
15.5 4.4 0.60 0.38 23.6 19.6
11.8
3.4 12.4 2.4
3.1 11.0 1.6
4.3
2.1
1.8
0.8
0.4
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT243-1
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-17
03-03-12
Fig 16. Package outline.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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