PCF8577C Datasheet, PDF (20/28 Pages) NXP Semiconductors – LCD direct/duplex driver with I2C-bus interface

Philips Semiconductors
LCD direct/duplex driver with
I²C-bus interface
Table 3 Bonding pad locations (dimensions in µm)
All x and y co-ordinates are referenced to the centre of the chip, see Fig.18.
SIGNAL
S32
S31
S30
S29
S28
S27
S26
S25
S24
S23
S22
S21
S20
S19
S18
S17
S16
S15
S14
S13
S12
S11
PAD POSITION CENTRED
x
y
−86
−257
−428
−599
−836
−836
−836
−836
−836
−836
−836
−836
−836
−836
−836
−836
−599
−428
−257
−86
85
256
941
941
941
941
941
769
598
427
256
85
−86
−257
−428
−599
−770
−941
−941
−941
−941
−941
−941
−941
SIGNAL
S10
S9
S8
S7
S6
S5
S4
S3
S2
S1
BP1
A2/BP2
V_DD
A1
A0/OSC
V_SS
SCL
SDA
Recpats
C
F
Product specification
PCF8577C
PAD POSITION CENTRED
x
y
427
−941
598
−941
836
−941
836
−770
836
−599
836
−428
836
−257
836
−86
836
85
836
256
836
427
836
598
836
769
836
941
598
941
427
941
256
941
85
941
−586
−580
−699
663
1998 Jul 30
20