TDA8926 Datasheet, PDF (2/32 Pages) NXP Semiconductors – Power stage 2 x 50 W class-D audio amplifier

Philips Semiconductors
Power stage 2 × 50 W class-D audio
amplifier
CONTENTS
15
1
FEATURES
15.1
15.2
2
APPLICATIONS
15.3
3
GENERAL DESCRIPTION
15.4
4
QUICK REFERENCE DATA
15.5
15.6
5
ORDERING INFORMATION
16
6
BLOCK DIAGRAM
17
7
PINNING
17.1
8
FUNCTIONAL DESCRIPTION
8.1
8.2
8.2.1
8.2.2
8.3
9
10
11
Power stage
17.2
Protection
17.3
Overtemperature
17.4
Short-circuit across the loudspeaker terminals
BTL operation
18
LIMITING VALUES
19
THERMAL CHARACTERISTICS
20
QUALITY SPECIFICATION
12
DC CHARACTERISTICS
13
AC CHARACTERISTICS
14
SWITCHING CHARACTERISTICS
14.1
Duty factor
Preliminary specification
TDA8926
TEST AND APPLICATION INFORMATION
BTL application
Package ground connection
Output power
Reference design
Reference design bill of material
Curves measured in reference design
PACKAGE OUTLINE
SOLDERING
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
2002 Oct 10
2