TDA8925 Datasheet, PDF (2/23 Pages) NXP Semiconductors – Power stage 2 x 15 to 25Wclass-D audio amplifier

Philips Semiconductors
Power stage 2 x 15 to 25 W class-D
audio amplifier
Product specification
TDA8925
CONTENTS
1
2
3
4
5
6
7
8
8.1
8.2
8.2.1
8.2.2
9
10
11
12
13
14
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Power stage
Protection
Overtemperature
Short-circuit across the loudspeaker terminals
LIMITING VALUES
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
DC CHARACTERISTICS
AC CHARACTERISTICS
SWITCHING CHARACTERISTICS
15
15.1
15.2
15.3
15.4
15.5
15.5.1
15.5.2
15.6
16
17
17.1
17.2
17.3
17.4
18
19
20
TEST AND APPLICATION INFORMATION
SE application
Package ground connection
Output power
Reference design
Reference design bill of material
Version 2; revision 5
Printed-circuit board
Curves measured in reference design
PACKAGE OUTLINES
SOLDERING
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
2004 May 06
2