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PHP2N40 Datasheet, PDF (2/7 Pages) NXP Semiconductors – PowerMOS transistor
Philips Semiconductors
PowerMOS transistor
Product specification
PHP2N40
ELECTRICAL CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
V(BR)DSS
∆V(BR)DSS /
∆Tj
RDS(ON)
VGS(TO)
gfs
IDSS
Drain-source breakdown
voltage
Drain-source breakdown
voltage temperature coefficient
Drain-source on resistance
Gate threshold voltage
Forward transconductance
Drain-source leakage current
IGSS
Qg(tot)
Qgs
Qgd
td(on)
tr
td(off)
tf
Ld
Gate-source leakage current
Total gate charge
Gate-source charge
Gate-drain (Miller) charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Internal drain inductance
Ld
Internal drain inductance
Ls
Internal source inductance
Ciss
Input capacitance
Coss
Output capacitance
Crss
Feedback capacitance
CONDITIONS
VGS = 0 V; ID = 0.25 mA
VDS = VGS; ID = 0.25 mA
VGS = 10 V; ID = 1.25 A
VDS = VGS; ID = 0.25 mA
VDS = 30 V; ID = 1.25 A
VDS = 400 V; VGS = 0 V
VDS = 320 V; VGS = 0 V; Tj = 125 ˚C
VGS = ±30 V; VDS = 0 V
ID = 2.5 A; VDD = 320 V; VGS = 10 V
VDD = 200 V; ID = 2.5 A;
RG = 24 Ω; RD = 78 Ω
Measured from contact screw on
tab to centre of die
Measured from drain lead 6 mm
from package to centre of die
Measured from source lead 6 mm
from package to source bond pad
VGS = 0 V; VDS = 25 V; f = 1 MHz
MIN.
400
-
-
2.0
0.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP. MAX. UNIT
-
-
V
0.45 - V/K
2.0 3.5 Ω
3.0 4.0 V
1.5
-
S
1
25 µA
30 250 µA
10 200 nA
20 25 nC
2
3
nC
8
12 nC
10
-
ns
25
-
ns
46
-
ns
25
-
ns
3.5
-
nH
4.5
-
nH
7.5
-
nH
240 -
pF
44
-
pF
26
-
pF
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
IS
Continuous source current
Tmb = 25˚C
(body diode)
ISM
Pulsed source current (body Tmb = 25˚C
diode)
VSD
Diode forward voltage
IS = 2.5 A; VGS = 0 V
trr
Reverse recovery time
IS = 2.5 A; VGS = 0 V;
dI/dt = 100 A/µs
Qrr
Reverse recovery charge
MIN. TYP. MAX. UNIT
-
-
2.5 A
-
-
10
A
-
-
1.2 V
- 200 -
ns
-
2.0
-
µC
June 1997
2
Rev 1.000