BYG70 Datasheet, PDF (2/6 Pages) NXP Semiconductors – Fast soft-recovery controlled avalanche rectifiers

Philips Semiconductors
Fast soft-recovery
controlled avalanche rectifiers
Preliminary specification
BYG70 series
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
absorption capability
• UL 94V-O classified plastic
package
• Shipped in 12 mm embossed tape.
DESCRIPTION
DO-214AC surface mountable
package with glass passivated chip.
handbook, 4 columns
cathode
band
k
a
Top view
The well-defined void-free case is of a
transfer-moulded thermo-setting
plastic.
Side view
MSA474
Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
V_RRM
V_R
I_F(AV)
I_FSM
E_RSM
T_stg
T_j
repetitive peak reverse voltage
BYG70D
BYG70G
BYG70J
continuous reverse voltage
BYG70D
BYG70G
BYG70J
average forward current
averaged over any 20 ms period;
T_tp = 100 °C; see Fig.2
averaged over any 20 ms period;
Al₂O₃ PCB mounting (see Fig.7);
T_amb = 60 °C; see Fig.3
non-repetitive peak forward current
non-repetitive peak reverse
avalanche energy
averaged over any 20 ms period;
epoxy PCB mounting (see Fig.7);
T_amb = 60 °C; see Fig.3
t = 10 ms half sine wave;
T_j = T_{j max} prior to surge;
V_R = V_RRMmax
L = 120 mH; T_j = T_{j max} prior to surge;
inductive load switched off
storage temperature
junction temperature
see Fig.4
MIN.
−
−
−
−
−
−
−
−
−
−
−
−65
−65
MAX. UNIT
200 V
400 V
600 V
200 V
400 V
600 V
1.00 A
0.53 A
0.39 A
20 A
10 mJ
+175 °C
+175 °C
1996 Jun 05
2