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BUK9509-55A Datasheet, PDF (2/14 Pages) NXP Semiconductors – TrenchMOS logic level FET
Philips Semiconductors
BUK95/9609-55A
TrenchMOS™ logic level FET
5. Quick reference data
Table 2: Quick reference data
Symbol Parameter
Conditions
Typ
VDS
drain-source voltage (DC)
-
ID
drain current (DC)
Tmb = 25 °C; VGS = 5 V
-
Ptot
total power dissipation
Tmb = 25 °C
-
Tj
junction temperature
-
RDSon drain-source on-state resistance
Tj = 25 °C; VGS = 5 V; ID = 25 A
7.6
Tj = 25 °C; VGS = 4.5 V; ID = 25 A
-
Tj = 25 °C; VGS = 10 V; ID = 25 A
6.4
6. Limiting values
Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
VDS
VDGR
VGS
ID
drain-source voltage (DC)
drain-gate voltage (DC)
gate-source voltage (DC)
drain current (DC)
RGS = 20 kΩ
Tmb = 25 °C; VGS = 5 V;
Figure 2 and 3
IDM
peak drain current
Ptot
total power dissipation
Tstg
storage temperature
Tj
junction temperature
Source-drain diode
IDR
reverse drain current (DC)
Tmb = 100 °C; VGS = 5 V; Figure 2
Tmb = 25 °C; pulsed; tp ≤ 10 µs;
Figure 3
Tmb = 25 °C; Figure 1
Tmb = 25 °C
IDRM
peak reverse drain current
Avalanche ruggedness
EDS(AL)S non-repetitive drain-source avalanche
energy
Tmb = 25 °C; pulsed; tp ≤ 10 µs
unclamped inductive load; ID = 75 A;
VDS ≤ 55 V; VGS = 5 V; RGS = 50 Ω;
starting Tmb = 25 °C
[1] Current is limited by power dissipation chip rating
[2] Continuous current is limited by package.
Min
-
-
-
[1] -
[2] -
[2] -
-
-
−55
−55
[1] -
[2] -
-
-
Max Unit
55
V
108
A
211
W
175
°C
9
mΩ
10
mΩ
8
mΩ
Max Unit
55
V
55
V
±15
V
108
A
75
A
75
A
433
A
211
W
+175 °C
+175 °C
108
A
75
A
433
A
400
mJ
9397 750 09229
Product data
Rev. 01 — 21 February 2002
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
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