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BUK466-100A Datasheet, PDF (2/7 Pages) NXP Semiconductors – PowerMOS transistor
Philips Semiconductors
PowerMOS transistor
Product specification
BUK466-100A
STATIC CHARACTERISTICS
Tmb = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
V(BR)DSS
VGS(TO)
IDSS
IDSS
IGSS
RDS(ON)
Drain-source breakdown
voltage
Gate threshold voltage
Zero gate voltage drain current
Zero gate voltage drain current
Gate source leakage current
Drain-source on-state
resistance
CONDITIONS
VGS = 0 V; ID = 0.25 mA
VDS = VGS; ID = 1 mA
VDS = 100 V; VGS = 0 V; Tj = 25 ˚C
VDS = 100 V; VGS = 0 V; Tj =125 ˚C
VGS = ±30 V; VDS = 0 V
VGS = 10 V; ID = 15 A
MIN. TYP. MAX. UNIT
100 -
-
V
2.1 3.0 4.0 V
-
1
10 µA
-
0.1 1.0 mA
-
10 100 nA
- 0.052 0.057 Ω
DYNAMIC CHARACTERISTICS
Tmb = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
gfs
Forward transconductance
Ciss
Input capacitance
Coss
Output capacitance
Crss
Feedback capacitance
td on
Turn-on delay time
tr
Turn-on rise time
td off
Turn-off delay time
tf
Turn-off fall time
Ld
Internal drain inductance
Ld
Internal drain inductance
Ls
Internal source inductance
CONDITIONS
VDS = 25 V; ID = 15 A
VGS = 0 V; VDS = 25 V; f = 1 MHz
VDD = 30 V; ID = 3 A;
VGS = 10 V;
Rgen = 50 Ω;
RGS = 50 Ω
Measured from contact screw on
tab to centre of die
Measured from drain lead 6 mm
from package to centre of die
Measured from source lead 6 mm
from package to source bond pad
MIN.
12
-
-
-
-
-
-
-
-
TYP.
16
1500
450
130
20
40
150
65
3.5
MAX.
-
2000
600
200
30
60
200
85
-
UNIT
S
pF
pF
pF
ns
ns
ns
ns
nH
-
4.5
-
nH
-
7.5
-
nH
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
Tmb = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
IDR
Continuous reverse drain
-
current
IDRM
Pulsed reverse drain current -
VSD
Diode forward voltage
IF = 34 A ; VGS = 0 V
trr
Reverse recovery time
IF = 34 A; -dIF/dt = 100 A/µs;
Qrr
Reverse recovery charge
VGS = 0 V; VR = 30 V
MIN. TYP. MAX. UNIT
-
-
34
A
-
- 136 A
-
1.8 2.5 V
- 100 -
ns
-
1.0
-
µC
February 1996
2
Rev 1.000