BGY288 Datasheet, PDF (17/22 Pages) NXP Semiconductors – Power amplifier with integrated control loop for GSM850, EGSM900, DCS1800 and PCS1900

Philips Semiconductors
BGY288
Power amplifier with integrated control loop
12. Soldering Recommendations
12.1 Reflow profile
The BGY288 is a laminate-based power amplifier module in a Leadless Grid Array (LGA)
package. The module can be assembled using a standard Surface Mount Technology
(SMT) reflow process in a convection or IR-oven. The minimum and maximum limits of the
temperature profile are shown in Figure 8. The actual profile has to be within these limits,
and will depend on the printed-circuit board material, the number and size of the
components to be assembled, and the type of solder which is being used.
temperature
T_P
T_R
T_E(max)
T_E(min)
α
α
β
t_E
t_R
t
001aaa705
Fig 8. Recommended reflow temperature profile
It is recommended to use a standard no-clean solder paste like SnPb for profiles having
leads containing solder, or SnAgCu for lead-free assembly processes. The parameters
and corresponding values for SnPb and SnAgCu solder are given in Table 10.
Table 10: Reflow soldering parameters
Symbol parameter
α
temperature gradient
T_E
pre-heat (soak) temperature
t_E
pre-heat time
T_R
reflow temperature
t_R
reflow time
T_P
maximum peak temperature
β
temperature gradient
time 25 °C to peak temperature
SnPb Solder
≤3
100 to 150
60 to 120
> 183
60 to 150
240
<5
6 minutes max.
SnAgCu solder Unit
≤3
°C/s
150 to 200
°C
60 to 180
s
> 217
°C
60 to 150
s
260
°C
<5
°C/s
8 minutes max.
12.2 Printed-circuit board layout
The printed-circuit board footprint layout is a copy of the metal pattern on the underside of
the LGA package. It is recommended that the printed-circuit board is designed with a
large ground plane, and that the solder lands of the ground plane solder mask are defined
as shown in Figure 9.
9397 750 14011
Preliminary data sheet
Rev. 01 — 2 February 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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