BCP56_15 Datasheet, PDF (17/22 Pages) SeCoS Halbleitertechnologie GmbH – NPN Silicon Medium Power Transistor

NXP Semiconductors
BCP56; BCX56; BC56PA
80 V, 1 A NPN medium power transistors
4.75
2.25
2
1.9
1.2
0.85
0.2
1.2
4.6
1.7
4.85
0.5
1
1.1
(3×)
(2×)
1.5
1.5
0.6
(3×)
0.7
(3×)
3.95
Fig 24. Reflow soldering footprint SOT89 (SC-62/TO-243)
6.6
2.4
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot089_fr
3.5
7.6
0.5
1.8
(2×)
solder lands
solder resist
occupied area
Dimensions in mm
1.9
1.9
1.5
(2×)
0.7
5.3
preferred transport direction during soldering
sot089_fw
Fig 25. Wave soldering footprint SOT89 (SC-62/TO-243)
BCP56_BCX56_BC56PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 25 October 2011
© NXP B.V. 2011. All rights reserved.
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