TDA8945S Datasheet, PDF (16/21 Pages) NXP Semiconductors – 15 W mono Bridge Tied Load BTL audio amplifier

Philips Semiconductors
16. Package outline
SIL9P: plastic single in-line power package; 9 leads
D
non-concave
x
Eh
TDA8945S
15 W mono BTL audio amplifier
SOT131-2
Dh
view B: mounting base side
d
A2
B
j
E
A₁
b
L
1
Z
e
9
wM
b_p
0
5
scale
10 mm
c
Q
DIMENSIONS (mm are the original dimensions)
UNIT
A₁
max.
A₂
b
max.
b_p
c
D⁽¹⁾
d
D_h
E ⁽¹⁾
e
E_h
j
L
Q
w
x
Z ⁽¹⁾
mm
2.0
4.6
4.4
1.1
0.75 0.48
0.60 0.38
24.0 20.0
23.6 19.6
10
12.2
11.8
2.54
6
3.4
3.1
17.2
16.5
2.1
1.8
0.25
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT131-2
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-03-11
99-12-17
Fig 15. SIL9P package outline.
9397 750 06866
Product specification
Rev. 02 — 7 April 2000
© Philips Electronics N.V. 2000. All rights reserved.
16 of 21