74ALVT16601_15 Datasheet, PDF (16/20 Pages) NXP Semiconductors – 18-bit universal bus transceiver; 3-state

Philips Semiconductors
74ALVT16601
18-bit universal bus transceiver; 3-state
13. Package outline
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm
SOT371-1
D
y
Z
56
pin 1 index
1
e
c
29
E
A
X
H_E
vM A
A₂
A₁
28
wM
b_p
Q
A
(A ₃)
θ
L_p
L
detail X
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D ⁽¹⁾ E ⁽¹⁾
e
H_E
L
L_p
Q
v
w
y
Z ⁽¹⁾
θ
mm
2.8
0.4
0.2
2.35
2.20
0.25
0.3
0.2
0.22 18.55
0.13 18.30
7.6
7.4
0.635
10.4
10.1
1.4
1.0
0.6
1.2
1.0
0.25 0.18
0.1
0.85
0.40
8^o
0^o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT371-1
REFERENCES
JEDEC
JEITA
MO-118
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 12. Package outline SOT371-1 (SSOP56)
74ALVT16601_3
Product data sheet
Rev. 03 — 5 July 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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