74AHC377 Datasheet, PDF (16/20 Pages) NXP Semiconductors – Octal D-type flip-flop with data enable; positive-edge trigger

Philips Semiconductors
Octal D-type flip-flop with data enable;
positive-edge trigger
Product specification
74AHC377; 74AHCT377
Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, SQFP
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC⁽³⁾, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
SOLDERING METHOD
WAVE
REFLOW⁽¹⁾
not suitable
not suitable⁽²⁾
suitable
not recommended⁽³⁾⁽⁴⁾
not recommended⁽⁵⁾
suitable
suitable
suitable
suitable
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Aug 15
16