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| TDA8943SF Datasheet, PDF (15/20 Pages) NXP Semiconductors – 6 W mono Bridge Tied Load BTL audio amplifier | |||
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Philips Semiconductors
TDA8943SF
6 W mono Bridge Tied Load (BTL) audio ampliï¬er
16. Package outline
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D1
q
P
P1
pin 1 index
A3
q2
q1
A
A4
A2
E
1
Z
e
b2
b
b1
L
9
wM
c
Q
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
max.
A3
A4
b
b1 b2
c D(1) D1 E(1) e
L
P P1 Q q q1
mm
18.5
17.8
3.7
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 3.9 2.75 3.4 1.75 15.1 4.4
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.4 2.50 3.2 1.55 14.9 4.2
q2
w
Z (1)
max.
5.9
5.7
0.25
1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT110-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-25
Fig 15. SIL9MPF package outline.
9397 750 06865
Product speciï¬cation
Rev. 02 â 7 April 2000
© Philips Electronics N.V. 2000. All rights reserved.
15 of 20
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