TDA4657 Datasheet, PDF (14/17 Pages) NXP Semiconductors – Generic multi-standard decoder

Philips Semiconductors
Generic multi-standard decoder
PACKAGE OUTLINES
DIP20: plastic dual in-line package; 20 leads (300 mil)
Preliminary specification
TDA4657
SOT146-1
D
L
Z
20
e
b
pin 1 index
1
A_{2 A}
A₁
wM
b₁
11
M_E
c
(e ₁)
M_H
E
10
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
A₂
min. max.
b
b₁
c
D ⁽¹⁾
E ⁽¹⁾
e
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
0.36 26.92 6.40
0.23 26.54 6.22
2.54
inches
0.17
0.020
0.13
0.068 0.021 0.014 1.060
0.051 0.015 0.009 1.045
0.25
0.24
0.10
e₁
7.62
0.30
L
3.60
3.05
0.14
0.12
M_E
8.25
7.80
0.32
0.31
M_H
10.0
8.3
0.39
0.33
w
Z ⁽¹⁾
max.
0.254 2.0
0.01 0.078
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT146-1
REFERENCES
JEDEC
EIAJ
SC603
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-05-24
June 1993
14