TDA3856 Datasheet, PDF (14/17 Pages) NXP Semiconductors – Quasi-split sound processor for all standards

Philips Semiconductors
Quasi-split sound processor for all standards
PACKAGE OUTLINES
SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)
Product specification
TDA3856
SOT234-1
D
L
Z
24
e
b
pin 1 index
A_{2 A}
A₁
wM
b₁
13
M_E
c
(e ₁)
M_H
E
1
12
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
c
D ⁽¹⁾
E ⁽¹⁾
e
e₁
L
mm
4.7 0.51 3.8
1.3
0.8
0.53 0.32 22.3
0.40 0.23 21.4
9.1
8.7
1.778 10.16
3.2
2.8
M_E
M_H
w
Z ⁽¹⁾
max.
10.7
10.2
12.2
10.5
0.18
1.6
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT234-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-04
June 1994
14