SA58631 Datasheet, PDF (14/19 Pages) NXP Semiconductors – 3 W BTL audio amplifier

Philips Semiconductors
15. Package outline
HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 4 x 4 x 0.85 mm
SA58631
3 W BTL audio amplifier
SOT909-1
X
D
BA
0
1
2 mm
scale
terminal 1
index area
terminal 1
index area
L
e₁
e
1
b
4
E
A
A₁
c
detail X
vM CA B
wM C
y₁ C
C
y
exposed tie bar (4×)
E_h
8
5
D_h
DIMENSIONS (mm are the original dimensions)
UNIT ^A(1)
max.
A1
b
c
D⁽¹⁾ Dh E⁽¹⁾ Eh
e
e1
mm
1
0.05 0.4
0.00 0.3
0.2
4.1
3.9
3.25
2.95
4.1 2.35
3.9 2.05
0.8
2.4
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT909-1
MO-229
L
0.65
0.40
v
wy
y1
0.1 0.05 0.05 0.1
EUROPEAN
PROJECTION
ISSUE DATE
05-09-26
05-09-28
Fig 22. Package outline SOT909-1 (HVSON8)
SA58631
Preliminary data sheet
Rev. 01 — 1 December 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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