TDA8541 Datasheet, PDF (13/20 Pages) NXP Semiconductors – 1 W BTL audio amplifier

Philips Semiconductors
1 W BTL audio amplifier
PACKAGE OUTLINES
SO8: plastic small outline package; 8 leads; body width 3.9 mm
Product specification
TDA8541
SOT96-1
D
y
Z
8
c
5
E
A
X
H_E
vM A
pin 1 index
1
e
A₂
A₁
4
b_p
wM
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT _max. A₁
A₂
A₃
b_p
c
D⁽¹⁾ E⁽²⁾
e
H_E
L
L_p
Q
v
w
y
Z ⁽¹⁾
θ
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25 0.25
0.1
0.7
0.3
8^o
inches
0.069
0.010
0.004
0.057
0.049
0.01
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.050
0.244
0.228
0.041
0.039
0.016
0.028
0.024
0.01
0.01
0.004
0.028
0.012
0^o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT96-1
IEC
076E03S
REFERENCES
JEDEC
EIAJ
MS-012AA
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
97-05-22
1998 Apr 01
13