TDA4671 Datasheet, PDF (13/16 Pages) NXP Semiconductors – Picture Signal Improvement PSI circuit

Philips Semiconductors
Picture Signal Improvement (PSI) circuit
PACKAGE OUTLINE
DIP18: plastic dual in-line package; 18 leads (300 mil)
Product specification
TDA4671
SOT102-1
D
L
Z
e
18
pin 1 index
M_E
A_{2 A}
A₁
wM
b₁
b
b₂
10
c
(e ₁)
M_H
E
1
9
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
b₂
c
D ⁽¹⁾
E ⁽¹⁾
e
e₁
L
M_E
M_H
w
Z ⁽¹⁾
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
1.40
1.14
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254 0.85
inches _0.19
0.020
0.15
0.055 0.021 0.055 0.013
0.044 0.015 0.044 0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01 0.033
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT102-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
93-10-14
95-01-23
1996 Dec 11
13