74ALVCH16501_15 Datasheet, PDF (13/18 Pages) NXP Semiconductors – 18-bit universal bus transceiver; 3-state

NXP Semiconductors
13. Package outline
74ALVCH16501
18-bit universal bus transceiver; 3-state
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm
SOT364-1
D
y
Z
56
E
A
X
c
HE
vM A
29
pin 1 index
1
e
A₂
A₁
28
wM
bp
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D⁽¹⁾ E⁽²⁾
e
H_E
L
L_p
Q
v
w
y
Z
θ
mm
1.2
0.15
0.05
1.05
0.85
0.25
0.28
0.17
0.2
0.1
14.1
13.9
6.2
6.0
0.5
8.3
7.9
1
0.8
0.4
0.50
0.35
0.25
0.08
0.1
0.5
0.1
8^o
0^o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT364-1
REFERENCES
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 11. Package outline SOT364-1 (TSSOP56)
74ALVCH16501
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 10 July 2012
© NXP B.V. 2012. All rights reserved.
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