TDA4867J Datasheet, PDF (12/14 Pages) NXP Semiconductors – Full bridge current driven vertical deflection booster

Philips Semiconductors
Full bridge current driven vertical
deflection booster
Preliminary specification
TDA4867J
PACKAGE OUTLINE
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
SOT523-1
non-concave
x
q1
Eh
D
D1
P
k
q2
Dh
view B: mounting base side
A2
E
B
L3
L2
L
q
L1
1
9
Z
e1
wM
Q
c
vM
e
bp
0
5
10 mm
m
e2
DIMENSIONS (mm are the original dimensions)
scale
UNIT A2⁽²⁾ bp c D⁽¹⁾ D1⁽²⁾ Dh E⁽¹⁾ Eh e e1 e2 k L L1 L2 L3 m P Q q q1 q2 v w x Z⁽¹⁾
mm
2.7 0.80 0.58 13.2
2.3 0.65 0.48 12.8
6.2
5.8
3.5
14.7
14.3
3.5
2.54 1.27 5.08
3.0
2.0
12.4 11.4
11.0 10.0
6.7
5.5
4.5
3.7
2.8
3.4
3.1
1.15
0.85
17.5
16.3
4.85
3.8
3.6
0.8
0.3
0.02
1.65
1.10
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
SOT523-1
EUROPEAN
PROJECTION
ISSUE DATE
98-11-12
00-07-03
2003 Feb 05
12