PESDXL4UF Datasheet, PDF (12/17 Pages) NXP Semiconductors – Low capacitance unidirectional quadruple ESD protection diode arrays

NXP Semiconductors
PESDxL4UF/G/W
Low capacitance unidirectional quadruple ESD protection diode arrays
9. Packing information
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.^[1]
Type number Package Description
PESD3V3L4UF SOT886
PESD5V0L4UF SOT886
PESD3V3L4UG SOT353
PESD5V0L4UG SOT353
PESD3V3L4UW SOT665
PESD5V0L4UW SOT665
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T4
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T4
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
Packing quantity
3000 4000 5000
[2] _-
-
-115
[3] _-
-
-132
[2] _-
-
-115
[3] _-
-
-132
[2] _{-115 -}
-
[4] _{-125 -}
-
[2] _{-115 -}
-
[4] _{-125 -}
-
-
-
-
-
-115 -
-
-
-
-
-115 -
8 000
-
-
-
-
-
-
-
-
-315
-
-315
-
10 000
-
-
-
-
-135
-165
-135
-165
-
-
-
-
[1] For further information and the availability of packing methods, see Section 13.
[2] T1: normal taping
[3] T4: 90° rotated reverse taping
[4] T2: reverse taping
10. Soldering
1.250
0.675
0.370
(6×)
0.500
0.270
(6×)
0.325
(6×)
1.700
0.500
0.425
(6×)
solder lands
solder paste
occupied area
Dimensions in mm
sot886_fr
Reflow soldering is the only recommended soldering method.
Fig 13. Reflow soldering footprint PESDxL4UF (SOT886)
PESDXL4UF_G_W_4
Product data sheet
Rev. 04 — 28 February 2008
© NXP B.V. 2008. All rights reserved.
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