NX3008NBKW_15 Datasheet, PDF (12/16 Pages) NXP Semiconductors – 30 V, 350 mA N-channel Trench MOSFET

NXP Semiconductors
10. Soldering
NX3008NBKW
30 V, 350 mA N-channel Trench MOSFET
2.65
1.85
1.325
2.35
0.6
(3×)
2
3
1
1.3
0.5
(3×)
0.55
(3×)
Fig 19. Reflow soldering footprint for SOT323 (SC-70)
1.425
(3×)
4.6
2.575
3.65 2.1
1.8
09
(2×)
Fig 20. Wave soldering footprint for SOT323 (SC-70)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot323_fr
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot323_fw
NX3008NBKW
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 2 August 2011
© NXP B.V. 2011. All rights reserved.
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