IP4284CZ10-TBR_TT_15 Datasheet, PDF (12/17 Pages) NXP Semiconductors – ESD protection for ultra high-speed interfaces

NXP Semiconductors
IP4284CZ10-TBR/TT
ESD protection for ultra high-speed interfaces
Footprint information for reflow soldering of TSSOP10 package
SOT552-1
Hx
Gx
P2
(0.125)
(0.125)
Hy Gy
C
D2 (4x)
P1
D1
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1
P2
Ay
By
C
D1 D2 Gx Gy Hx Hy
0.500 0.550 5.400 3.200 1.100 0.300 0.400 2.750 3.900 3.700 5.650
Reflow soldering is the only recommended soldering method.
Fig 15. Reflow soldering footprint SOT552-1 (TSSOP10)
By Ay
sot552-1_fr
IP4284CZ10-TBR_TT
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 19 May 2011
© NXP B.V. 2011. All rights reserved.
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