74ABT126D-602 Datasheet, PDF (12/15 Pages) NXP Semiconductors – Quad buffer; 3-state

Philips Semiconductors
74ABT126
Quad buffer; 3-state
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
c
y
Z
14
8
E
A
X
H_E
vM A
pin 1 index
1
e
7
b_p
wM
A₂
A₁
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D ⁽¹⁾ E ⁽²⁾
e
H_E
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT402-1
MO-153
L
L_p
Q
v
w
y
Z ⁽¹⁾ θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.72
0.38
8^o
0^o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 9. Package outline SOT402-1 (TSSOP14)
9397 750 14597
Product data sheet
Rev. 04 — 17 February 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
12 of 15