2N7002BK_15 Datasheet, PDF (12/16 Pages) NXP Semiconductors – 60 V, 350 mA N-channel Trench MOSFET

NXP Semiconductors
10. Soldering
2N7002BK
60 V, 350 mA N-channel Trench MOSFET
3.3
2.9
1.9
3 1.7
2
0.7
0.6
(3×)
(3×)
0.5
(3×)
0.6
(3×)
1
Fig 19. Reflow soldering footprint SOT23 (TO-236AB)
2.2
1.2
(2×)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot023_fr
1.4
(2×)
4.6 2.6
1.4
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
2.8
4.5
sot023_fw
Fig 20. Wave soldering footprint SOT23 (TO-236AB)
2N7002BK
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 June 2010
© NXP B.V. 2010. All rights reserved.
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