2N7002BKW_15 Datasheet, PDF (12/16 Pages) NXP Semiconductors – 60 V, 310 mA N-channel Trench MOSFET

NXP Semiconductors
10. Soldering
2N7002BKW
60 V, 310 mA N-channel Trench MOSFET
2.65
1.85
1.325
2.35
0.6
(3×)
2
3
1
1.3
0.5
(3×)
0.55
(3×)
Fig 19. Reflow soldering footprint SOT323 (SC-70)
1.425
(3×)
4.6
2.575
3.65 2.1
1.8
09
(2×)
Fig 20. Wave soldering footprint SOT323 (SC-70)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot323_fr
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot323_fw
2N7002BKW
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 June 2010
© NXP B.V. 2010. All rights reserved.
12 of 16