SA58670 Datasheet, PDF (11/18 Pages) NXP Semiconductors – 2.1 W/channel stereo Class D audio amplifier

NXP Semiconductors
SA58670
2.1 W/channel stereo Class D audio amplifier
11.6 Additional thermal information
The SA58670 HVQFN20 package incorporates an exposed die attach paddle (DAP) that
is designed to solder mount directly to the PCB heat spreader. By the use of thermal vias,
the DAP may be soldered directly to a ground plane or special heat sinking layer designed
into the PCB. The thickness and area of the heat spreader may be maximized to optimize
heat transfer and achieve lowest package thermal resistance.
SA58670_1
Objective data sheet
Rev. 01 — 22 June 2007
© NXP B.V. 2007. All rights reserved.
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