RC01 Datasheet, PDF (11/11 Pages) List of Unclassifed Manufacturers – General purpose chip resistors

IEC IEC 68-2
115-8 TEST
CLAUSE METHOD
TEST
PROCEDURE
RESISTANCE
RANGE
4.24.2
4.25.1
4.23.2
4.8.4.2
3 (Ca)
27 (Ba)
damp heat
(steady state)
(IEC)
endurance
(at 70 °C)
endurance at
upper category
temperature
temperature
coefficient
56 days; 40 °C; 90 to 95% RH;
loaded with 0.01 P_n
(IEC steps: 4 to 100 V)
1000 hours; loaded with P_n or V_max;
1.5 hours on and 0.5 hours off
1000 hours; no load
R ≤ 1 MΩ
R > 1 MΩ
R ≤ 1 MΩ
R > 1 MΩ
R ≤ 1 MΩ
at 20/LCT/20 °C and 20/UCT/20 °C
(TC × 10^−6/K)
R > 1 MΩ
R<5Ω
R ≤ 10 MΩ
Other tests in accordance with IEC 115 clauses and IEC 68 test method
4.17
4.6.1.1
4.12
20 (Tb)
solderability
(after ageing)
insulation
resistance
noise
8 hours steam or 16 hours 155 °C;
unmounted chips completely
immersed for 2 ±0.5 s in a solder
bath at 235 ±5 °C
voltage (DC) after 1 minute,
metal block method:
100 V for RC01 and RC11,
50 V for RC21 and RC31
IEC publication 195
(measured with Quantech -
equipment)
R ≤ 1 kΩ
R ≤ 10 kΩ
R ≤ 100 kΩ
R ≤ 1 MΩ
Other applicable tests
humidity load
(steady state)
(JIS)
leaching
trio damp heat
test
1000 hours; +40 °C; 90 to 95% RH;
loaded with P_n or V_max;
1.5 hours on and 0.5 hours off
unmounted chips; 60 s; 260 ±5 °C
1 000 hours; +85 °C; 85% RH;
loaded with 0.1 P_n or V_max
R ≤ 1 MΩ
R > 1 MΩ
R ≤ 1 MΩ
R > 1 MΩ
REQUIREMENTS
RC01
RC11
RC21
∆R/R max.:
±1.5% +0.1 Ω
∆R/R max.: ±3% +0.1 Ω
∆R/R max.:
±1.5% +0.1 Ω
∆R/R max.: ±3% +0.1 Ω
∆R/R max.:
±1.5% +0.1 Ω
∆R/R max.: ±3% +0.1 Ω
≤ ±250
≤ ±200
RC31
∆R/R max.:
±3% +0.1 Ω
not applicable
∆R/R max.:
±3% +0.1 Ω
not applicable
∆R/R max.:
±3% +0.1 Ω
not applicable
not applicable
≤ ±200
good tinning (≥95% covered); no damage
R_ins min.: 10³ MΩ
max. 1 µV/V
max. 3 µV/V
max. 6 µV/V
max. 10 µV/V
∆R/R max.: ±3% +0.1 Ω
∆R/R max.: ±5% +0.1 Ω
not applicable
good tinning; no leaching
∆R/R max.: ±3% +0.1 Ω
∆R/R max.: ±5% +0.1 Ω
not applicable