BGY206 Datasheet, PDF (11/16 Pages) NXP Semiconductors – UHF amplifier module

Philips Semiconductors
UHF amplifier module
PACKAGE OUTLINE
Rectangular single-ended surface-mount package; metal cap; 4 in-line leads
Product specification
BGY206
SOT388B
U
A
y
E
U1
1
2
3
4
Q
L
b
wM
c
Z
e
e
e1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
b
c
e
e1
E
L
mm
2.2
1.8
0.56
0.46
0.30
0.20
5.08
2.54
12.2
11.8
0.7
0.3
Q
U
U1
w
y
Z
3.4
3.0
17.3
16.9
6.0
5.6
0.25 0.15
2.3
1.9
OUTLINE
VERSION
IEC
SOT388B
1998 May 08
REFERENCES
JEDEC
EIAJ
11
EUROPEAN
PROJECTION
ISSUE DATE
97-11-19