74AUP2G34_15 Datasheet, PDF (11/19 Pages) NXP Semiconductors – Low-power dual buffer

NXP Semiconductors
13. Package outline
Plastic surface-mounted package; 6 leads
D
B
74AUP2G34
Low-power dual buffer
SOT363
E
A
X
y
6
5
4
pin 1
index
1
2
e1
bp
e
3
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
max
bp
c
D
E
e
e₁
HE Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30 0.25
0.20 0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45 0.25
0.15 0.15
0.2
0.2
0.1
OUTLINE
VERSION
IEC
SOT363
REFERENCES
JEDEC
JEITA
SC-88
Fig 9. Package outline SOT363 (SC-88)
74AUP2G34
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 10 January 2013
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
© NXP B.V. 2013. All rights reserved.
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