TDA8446 Datasheet, PDF (10/16 Pages) NXP Semiconductors – Fast RGB/YC switch for digital decoding

Philips Semiconductors
Fast RGB/YC switch for digital decoding
PACKAGE OUTLINES
DIP20: plastic dual in-line package; 20 leads (300 mil)
Product specification
TDA8446
SOT146-1
D
L
Z
20
e
b
pin 1 index
1
A_{2 A}
A₁
wM
b₁
11
M_E
c
(e ₁)
M_H
E
10
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
c
D ⁽¹⁾
E ⁽¹⁾
e
e₁
L
M_E
M_H
w
Z ⁽¹⁾
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
0.36 26.92 6.40
0.23 26.54 6.22
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2.0
inches
0.17
0.020
0.13
0.068 0.021 0.014 1.060
0.051 0.015 0.009 1.045
0.25
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.078
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT146-1
REFERENCES
JEDEC
EIAJ
SC603
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-05-24
1995 Feb 16
10