BLF202 Datasheet, PDF (10/16 Pages) NXP Semiconductors – HF/VHF power MOS transistor

Philips Semiconductors
HF/VHF power MOS transistor
Product specification
BLF202
MOUNTING RECOMMENDATIONS
Both the metallized groundplate and leads contribute to the heatflow. It is recommended that the transistor is mounted
on a grounded metallized area of 0.8 mm maximum thickness on the printed-circuit board, equipped with at least 12
(0.5 mm diameter) through metallized holes filled with solder.
A thermal resistance R_th(mb-h) of 5 K/W can be achieved if heatsink compound is applied when the transistor is mounted
on the printed-circuit board.
handbook, full pagewidth
7.38 3.60
1.87 (2×)
0.60 (4×)
0.80 (2×)
0.50 (12×)
1.00 (8×)
Dimensions in mm.
1.00 (9×)
4.60
MGK390
Fig.15 Footprint SOT409A.
1999 Oct 20
10