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TDA1308 Datasheet, PDF (1/12 Pages) NXP Semiconductors – Class AB stereo headphone driver | |||
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Philips Semiconductors
Class AB stereo headphone driver
Product speciï¬cation
TDA1308
FEATURES
⢠Wide temperature range
⢠No switch ON/OFF clicks
⢠Excellent power supply ripple rejection
⢠Low power consumption
⢠Short-circuit resistant
⢠High performance
â high signal-to-noise ratio
â high slew rate
â low distortion
⢠Large output voltage swing.
GENERAL DESCRIPTION
The TDA1308 is an integrated class AB stereo headphone
driver contained in an SO8 or a DIP8 plastic package. The
device is fabricated in a 1 mm CMOS process and has
been primarily developed for portable digital audio
applications.
QUICK REFERENCE DATA
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 â¦; unless otherwise speciï¬ed.
SYMBOL
PARAMETER
CONDITIONS
MIN.
VDD
VSS
IDD
Ptot
Po
(THD + N)/S
S/N
αcs
PSRR
Tamb
supply voltage
single
3.0
dual
1.5
negative supply voltage
â1.5
supply current
no load
â
total power dissipation
no load
â
maximum output power
THD < 0.1%; note 1
â
total harmonic distortion plus note 1
noise-to-signal ratio
â
â
RL = 5 kâ¦
â
signal-to-noise ratio
100
channel separation
â
RL = 5 kâ¦
â
power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV â
operating ambient
â40
temperature
TYP.
5.0
2.5
â2.5
3
15
60
0.03
â70
â101
110
70
105
90
â
MAX. UNIT
7.0 V
3.5 V
â3.5 V
5
mA
25
mW
â
mW
0.06 %
â65 dB
â
dB
â
dB
â
dB
â
dB
â
dB
+85 °C
Note
1. VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB).
ORDERING INFORMATION
TYPE NUMBER
TDA1308
TDA1308T
NAME
DIP8
SO8
PACKAGE
DESCRIPTION
plastic dual in-line package; 8 leads (300 mil)
plastic small outline package; 8 leads; body width 3.9 mm
VERSION
SOT97-1
SOT96-1
August 1994
2
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