SOT685-1 Datasheet, PDF (1/1 Pages) NXP Semiconductors – Package outline

Philips Semiconductors
PDF: 2002 Nov 27
Package outline
HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 6 x 5 x 0.85 mm
SOT685-1
0
2.5
5 mm
X
scale
D
BA
E
terminal 1
index area
terminal 1
index area
L
e1
e
b
1
4
vMC A B
wM C
A
A1
c
detail X
y1 _C
C
y
Eh
eh
exposed tie bar (4×)
8
5
Dh
DIMENSIONS (mm are the original dimensions)
UNIT ^A(1)
max.
A1
b
c
D⁽¹⁾ Dh E⁽¹⁾ Eh
e
e1 eh L
v
w
y
y1
mm
1
0.05
0.00
0.5
0.3
0.2
5.15
4.85
3.95
3.65
6.15
5.85
3.65
3.35
1.27
3.81
0.35
0.75
0.50
0.1
0.05 0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
SOT685-1
---
ISSUE DATE
02-08-12
02-11-27