PUSB3AB4_15 Datasheet, PDF (1/9 Pages) NXP Semiconductors – ESD protection for ultra high-speed interfaces

PUSB3AB4
ESD protection for ultra high-speed interfaces
Rev. 1 — 25 August 2015
Objective data sheet
1. Product profile
1.1 General description
The device is designed to protect high-speed interfaces such as SuperSpeed USB 3.1 at
10 Gbps, High-Definition Multimedia Interface (HDMI), DisplayPort, external Serial
Advanced Technology Attachment (eSATA) and Low Voltage Differential Signaling (LVDS)
interfaces against ElectroStatic Discharge (ESD).
The device includes a high-level ESD protection diode structure protecting sensitive
transmitters and receivers for ultra high-speed signal lines. The device is encapsulated in
a leadless small DFN2510A-10 (SOT1176-1) plastic package.
All signal lines are protected by a special diode configuration offering ultra low line
capacitance of only 0.2 pF maximum. These diodes utilize a snapback structure in order
to provide protection to downstream components from ESD voltages up to 15 kV contact
exceeding IEC 61000-4-2, level 4.
1.2 Features and benefits
 System-level ESD protection for USB 2.0 and SuperSpeed USB 3.1 at 10 Gbps,
HDMI, DisplayPort, eSATA and LVDS
 Line capacitance of only 0.2 pF maximum for each channel
 Outstanding system protection: extremely deep snapback combined with dynamic
resistance of only 0.4 .
 All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of 15 kV exceeding IEC 61000-4-2, level 4
 Matched 0.5 mm trace spacing
 Signal lines with  0.05 pF matching capacitance between signal pairs
 Design-friendly ‘pass-through’ signal routing
1.3 Applications
The device is designed for high-speed receiver and transmitter port protection:
 Smartphones, tablet computers, Mobile Internet Devices (MID) and portable devices
 TVs and monitors
 DVD recorders and players
 Notebooks, main board graphic cards and ports
 Set-top boxes and game consoles