NCX8200_15 Datasheet, PDF (1/14 Pages) NXP Semiconductors – Audio jack configuration switch matrix

NCX8200
Audio jack configuration switch matrix
Rev. 1 — 15 May 2015
Product data sheet
1. General description
The NCX8200 is an advanced audio jack configuration switch matrix device that supports
3- and 4-pole connectors. It allows reconfiguration of the GND, microphone-bias contact
to comply with the American Headset Jack (AHJ) and the Open Mobile Terminal Platform
(OMTP) pinout. Furthermore, a GND sense path supports quasi-differential amplifier
architectures. The device contains Human Body Model compliant ESD protection diodes
rated 8 kV at all pins. The device can be operated from a supply in the range of 1.6 V to
3.6 V. It supports a broad variety of after-market headphones.
2. Features and benefits
 AHJ and OMTP headset jack pinout support
 Low supply current
 Sense path to GND for quasi differential amplifier configuration
 Low THD and noise microphone pass through channel
 Ultra low R_DSon of ground and sense switches
 High power supply ripple rejection
 ESD protection: HBM JEDEC JDS-001 Class 3B exceeds 8 kV
 Operating ambient temperature: 40C to +85C
 1.22 mm  1.22 mm  0.5 mm WLCSP9 package
3. Applications
 Headphones with integrated microphone and remote control buttons
4. Ordering information
Table 1. Ordering information
Type number
Package
Name
Description
NCX8200UK
WLCSP9 wafer chip-scale package; 9 bumps; 1.22  1.22  0.5 mm
5. Marking
Version
NCX8200UK
Table 2. Marking codes
Type number
NCX8200UK
Marking code
qx82