MF1ICS7001 Datasheet, PDF (1/7 Pages) NXP Semiconductors – Standard 4Kbyte card IC sawn wafer on UV-tape addendum

MF1 IC S70 01
Standard 4Kbyte card IC sawn wafer on UV-tape addendum
Rev. 3.1 — 18 April 2007
101731
Product data sheet
PUBLIC
1. General description
The MF1 IC S70 01 is a contactless smart card IC designed for card IC coils following the
MIFARE card IC coil design guide and is qualified to work properly in NXP reader
environment, which is built according to NXP specification.
This specification describes electrical, physical and dimensional properties of wafers.
2. Ordering information
Table 1. Ordering information
Type number
Package
Name
MF1ICS7001W/V9D
Description
Die on sawn wafer
Ordering Code
9352 774 53005
3. Mechanical specification
3.1 Wafer
• Diameter:
• Thickness:
• PGDW:
• PCM location:
3.2 Wafer backside
• Material:
• Treatment:
• Roughness:
3.3 Chip dimensions
• Chip size:
• Scribe lines:
8”
150 µm ± 15 µm
15601
reticle area
Si
ground and stress relieve
R_a max. 0.5 µm
R_t max. 5 µm
1.42 x 1.34 mm
x-line: 86.4 µm
y-line: 86.4 µm