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| MF1ICS5005 Datasheet, PDF (1/7 Pages) NXP Semiconductors – Standard Card IC Specification “bumped sawn wafer on UV-tape” | |||
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INTEGRATED CIRCUITS
ADDENDUM
Standard Card IC
MF1 IC S50 05
Specification âbumped sawn wafer on UV-tapeâ
Product Specification
Revision 3.0
PUBLIC
August 2004
Philips
Semiconductors
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