BYC10B-600 Datasheet, PDF (1/6 Pages) NXP Semiconductors – Rectifier diode ultrafast, low switching loss

Philips Semiconductors
Rectifier diode
ultrafast, low switching loss
Product specification
BYC10B-600
FEATURES
• Extremely fast switching
• Low reverse recovery current
• Low thermal resistance
• Reduces switching losses in
associated MOSFET
SYMBOL
k
tab
QUICK REFERENCE DATA
V_R = 600 V
a
V_F ≤ 1.8 V
3
I_F(AV) = 10 A
t_rr = 19 ns (typ)
APPLICATIONS
• Active power factor correction
• Half-bridge lighting ballasts
• Half-bridge/ full-bridge switched
mode power supplies.
The BYC10B-600 is supplied in
the SOT404 surface mounting
package.
PINNING
PIN
DESCRIPTION
1 no connection
2 cathode¹
3 anode
tab cathode
SOT404
tab
2
13
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER
CONDITIONS
V_RRM
V_RWM
V_R
I_F(AV)
I_FRM
I_FSM
T_stg
T_j
Peak repetitive reverse voltage
Crest working reverse voltage
Continuous reverse voltage
Average forward current
Repetitive peak forward current
Non-repetitive peak forward
current.
Storage temperature
Operating junction temperature
T_mb ≤ 114 ˚C
δ=
T_mb
0.5; with
≤ 78 ˚C¹
reapplied
V_RRM(max);
δ=
T_mb
0.5; with
≤ 78 ˚C¹
reapplied
V_RRM(max);
t = 10 ms
t = 8.3 ms
sinusoidal; T_j = 150˚C prior to surge
with reapplied V_RWM(max)
MIN.
-
-
-
-
-
-
-
-40
-
MAX.
600
600
500
10
20
65
71
UNIT
V
V
V
A
A
A
A
150
˚C
150
˚C
THERMAL RESISTANCES
SYMBOL PARAMETER
R_{th j-mb}
R_{th j-a}
Thermal resistance junction to
mounting base
Thermal resistance junction to
ambient
CONDITIONS
minimum footprint, FR4 board
MIN.
-
-
TYP. MAX. UNIT
-
2 K/W
50
- K/W
1 it is not possible to make connection to pin 2 of the SOT404 package
September 1998
1
Rev 1.100