BUT12XI Datasheet, PDF (1/7 Pages) NXP Semiconductors – Silicon Diffused Power Transistor

Philips Semiconductors
Silicon Diffused Power Transistor
Product specification
BUT12XI
GENERAL DESCRIPTION
Improved high-voltage, high-speed glass-passivated npn power transistor in a plastic full-pack envelope specially
suited for overhead/high frequency lighting ballast applications and converters, inverters, switching regulators,
motor control systems, etc.
QUICK REFERENCE DATA
SYMBOL
V_CESM
V_CEO
I_C
I_CM
P_tot
V_CEsat
PARAMETER
Collector-emitter voltage peak value
Collector-emitter voltage (open base)
Collector current (DC)
Collector current peak value
Total power dissipation
Collector-emitter saturation voltage
I_Csat
Collector saturation current
t_f
Inductive fall time
CONDITIONS
V_BE = 0 V
T_hs ≤ 25 ˚C
I_C = 5.0 A;I_B = 0.86 A
I_Con = 5.0A;I_Bon = 1.0A,T_j ≤100˚C
TYP.
-
-
-
-
-
-
MAX.
1000
450
8
20
33
1.5
UNIT
V
V
A
A
W
V
5
-
A
-
300 ns
PINNING - SOT186A
PIN
DESCRIPTION
1 base
2 collector
3 emitter
case isolated
PIN CONFIGURATION
case
12 3
SYMBOL
c
b
e
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
V_CESM
V_CEO
I_C
I_CM
I_B
I_BM
P_tot
T_stg
T_j
Collector-emitter voltage peak value
Collector-emitter voltage (open base)
Collector current (DC)
Collector current peak value
Base current (DC)
Base current peak value
Total power dissipation
Storage temperature
Junction temperature
V_BE = 0 V
T_hs ≤ 25 ˚C
THERMAL RESISTANCES
SYMBOL
R_{th j-hs}
R_{th j-a}
PARAMETER
Junction to heatsink
Junction to ambient
CONDITIONS
with heatsink compound
in free air
MIN.
-
-
-
-
-
-
-
-65
-
MAX.
1000
450
8
20
4
6
33
150
150
UNIT
V
V
A
A
A
A
W
˚C
˚C
TYP.
-
55
MAX.
3.65
-
UNIT
K/W
K/W
June 1997
1
Rev 1.000