BGW211 Datasheet, PDF (1/4 Pages) NXP Semiconductors – Low-power WLAN SiP

BGW211 Low-power
WLAN SiP
Complete, single-package 802.11g
solution for mobile phones and
portable consumer devices
Optimized for use in battery-powered handheld devices,
the BGW211 System-in-a-Package (SiP) delivers complete
802.11g functionality with the industry’s lowest standby and
operating power consumption. It requires no external com-
ponents and uses only 150 mm² of board area for the total
802.11g solution.
Semiconductors
The BGW211 is Philips’ third-generation System-in-a-Package (SiP)
solution for low-power 802.11 Wireless LAN (WLAN). Supporting
complete 802.11g functionality, it enables consumers to access data and
multimedia content through WLAN networks up to five times faster
than current 802.11b products without compromising battery life.
The BGW211 delivers industry-leading standby and operating power in a
package that measures only 150 mm² and requires no external compo-
nents for operation. Extensive support for Quality of Service (QoS) and
coexistence with Bluetooth wireless make it robust enough for very
demanding portable applications.
Key features
• Advanced, single-package WLAN 802.11g optimized for mobile
handheld devices
– No RF-critical design required
– Low total cost of ownership
• Lowest-power consumption in standby (< 2 mW) and operating
modes (PA, RF, baseband/MAC)
• Ultra-small form factor
– Low-profile 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm)
– No external components required
• Ideal mobile architecture
– No WLAN related processor load in all operating modes
– Integrated ARM7 controller with associated memories
• Comprehensive QoS
– All mandatory 802.11e features, plus DLS, Block ACK, APSD
– Optimized for real-time applications with minimal system power
consumption
• Co-exists with Bluetooth^®
• Seamless upgrade path from BGW200 802.11b SiP
• Complete software drivers, utilities, and diagnostic tools
The latest SiP technology from Philips allows all of the components
needed for a complete 802.11g WLAN subsystem to be contained in
a single, low-profile HVQFN package that measures only 10 x 15 x 1.3
mm. The SiP contains the industry’s first 90-nm CMOS 802.11g base-
band/MAC and a silicon-germanium BiCMOS radio transceiver. Unlike
other “one-chip” solutions, which require the use of external receive
LNAs, transmit power amplifiers, and/or additional components, the
BGW211 SiP requires no external components to meet the range and
throughput performance requirements of mobile handsets and network
operators.
By providing complete system functionality in a single package, the SiP
format delivers quicker design cycles, reduces risk, simplifies manufac-
turing, and reduces the bill of materials. Also, because the SiP offers
fully tested functionality, it lets the customer’s development team focus
their energy on innovative product design instead of the complex issues
related to RF layout.